| 圖片 | 型號(hào) | 品牌 | 封裝 | 數(shù)量 | 描述 | PDF資料 |
|---|---|---|---|---|---|---|
|
ZSSC3136BE1B | IDT, Integrated Device Technology Inc | - | WAFER (UNSAWN) - BOX | ||
| 參數(shù)：IDT, Integrated Device Technology Inc|托盤|*|在售|-|-|-|-|-|-|-|-|... | ||||||
|
|
ZSSC3136BE1C | IDT, Integrated Device Technology Inc | - | DICE (WAFER SAWN) - FRAME | ||
| 參數(shù)：IDT, Integrated Device Technology Inc|托盤|*|在售|-|-|-|-|-|-|-|-|... | ||||||
|
|
ZSSC3136BE1D | IDT, Integrated Device Technology Inc | - | DICE (WAFER SAWN) - WAFFLE PACK | ||
| 參數(shù)：IDT, Integrated Device Technology Inc|托盤|*|在售|-|-|-|-|-|-|-|-|... | ||||||
|
|
ZSSC3138BA1C | IDT, Integrated Device Technology Inc | - | DICE (WAFER SAWN) - FRAME | ||
| 參數(shù)：IDT, Integrated Device Technology Inc|托盤|*|在售|-|-|-|-|-|-|-|-|... | ||||||
|
|
ZSSC3138BE1C | IDT, Integrated Device Technology Inc | - | DICE (WAFER SAWN) - FRAME | ||
| 參數(shù)：IDT, Integrated Device Technology Inc|托盤|*|在售|-|-|-|-|-|-|-|-|... | ||||||
|
|
ZSSC3154BA1C | IDT, Integrated Device Technology Inc | - | DICE (WAFER SAWN) - FRAME | ||
| 參數(shù)：IDT, Integrated Device Technology Inc|托盤|*|在售|-|-|-|-|-|-|-|-|... | ||||||
|
|
ZSSC3154BE1B | IDT, Integrated Device Technology Inc | - | WAFER (UNSAWN) - BOX | ||
| 參數(shù)：IDT, Integrated Device Technology Inc|托盤|*|在售|-|-|-|-|-|-|-|-|... | ||||||
|
|
ZSSC3154BE1C | IDT, Integrated Device Technology Inc | - | DICE (WAFER SAWN) - FRAME | ||
| 參數(shù)：IDT, Integrated Device Technology Inc|托盤|*|在售|-|-|-|-|-|-|-|-|... | ||||||
|
|
ZSSC3154BE1D | IDT, Integrated Device Technology Inc | - | DICE (WAFER SAWN) - WAFFLE PACK | ||
| 參數(shù)：IDT, Integrated Device Technology Inc|托盤|*|在售|-|-|-|-|-|-|-|-|... | ||||||
|
|
ZSSC3170EA1B | IDT, Integrated Device Technology Inc | - | WAFER (UNSAWN) - BOX | ||
| 參數(shù)：IDT, Integrated Device Technology Inc|托盤|*|在售|-|-|-|-|-|-|-|-|... | ||||||
|
|
ZSSC3170EA1C | IDT, Integrated Device Technology Inc | - | DICE (WAFER SAWN) - FRAME | ||
| 參數(shù)：IDT, Integrated Device Technology Inc|托盤|*|在售|-|-|-|-|-|-|-|-|... | ||||||
|
|
ZSSC3170EA1D | IDT, Integrated Device Technology Inc | - | DICE (WAFER SAWN) - WAFFLE PACK | ||
| 參數(shù)：IDT, Integrated Device Technology Inc|托盤|*|在售|-|-|-|-|-|-|-|-|... | ||||||
|
|
ZSSC3170EE1B | IDT, Integrated Device Technology Inc | - | WAFER (UNSAWN) - BOX | ||
| 參數(shù)：IDT, Integrated Device Technology Inc|托盤|*|在售|-|-|-|-|-|-|-|-|... | ||||||
|
|
ZSSC3170EE1C | IDT, Integrated Device Technology Inc | - | DICE (WAFER SAWN) - FRAME | ||
| 參數(shù)：IDT, Integrated Device Technology Inc|托盤|*|在售|-|-|-|-|-|-|-|-|... | ||||||
|
|
ZSSC3170EE1D | IDT, Integrated Device Technology Inc | - | DICE (WAFER SAWN) - WAFFLE PACK | ||
| 參數(shù)：IDT, Integrated Device Technology Inc|托盤|*|在售|-|-|-|-|-|-|-|-|... | ||||||
|
|
ZSSC3170FE1B | IDT, Integrated Device Technology Inc | - | WAFER (UNSAWN) - BOX | ||
| 參數(shù)：IDT, Integrated Device Technology Inc|托盤|*|在售|-|-|-|-|-|-|-|-|... | ||||||
|
|
ZSSC3170FE1C | IDT, Integrated Device Technology Inc | - | DICE (WAFER SAWN) - FRAME | ||
| 參數(shù)：IDT, Integrated Device Technology Inc|托盤|*|在售|-|-|-|-|-|-|-|-|... | ||||||
|
|
ZSSC3218BI1B ES | IDT, Integrated Device Technology Inc | - | WAFER (UNSAWN) - BOX | ||
| 參數(shù)：IDT, Integrated Device Technology Inc|托盤|*|在售|-|-|-|-|-|-|-|-|... | ||||||
|
|
ZSSC3218BI1C | IDT, Integrated Device Technology Inc | - | DICE (WAFER SAWN) - FRAME | ||
| 參數(shù)：IDT, Integrated Device Technology Inc|托盤|*|在售|-|-|-|-|-|-|-|-|... | ||||||
|
|
ZSSC3218BI1D ES | IDT, Integrated Device Technology Inc | - | DICE (WAFER SAWN) - WAFFLE PACK | ||
| 參數(shù)：IDT, Integrated Device Technology Inc|托盤|*|在售|-|-|-|-|-|-|-|-|... | ||||||
113/115 首頁(yè) 上頁(yè) [108] [109] [110] [111] [112] [113] [114] [115] 下頁(yè) 尾頁(yè)
